Materials Science Report
VerifiedAdded on  2019/09/22
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Report
AI Summary
This report details various thin film deposition methods, including Atomic Layer Deposition (ALD), different types of sputtering (electronic, potential, and chemical), Metalorganic Chemical Vapor Deposition (MOCVD), and Molecular Beam Epitaxy (MBE). It explains the scientific formulation for silicon nitride (SiNx) and lists a wide variety of materials achievable through ALD, such as Al2O3, SiO2, ZnO, various metals, nitrides, and oxides in solid, liquid, and gas phases. The report also differentiates between the pressure regimes and source materials used in MOCVD and MBE, noting that both can be used to grow oxide thin films. The provided solution focuses on achieving high tensile stress through a specific ALD process involving silicon-containing precursor gas and nitrogen-containing plasma.
