Internet of Things for Smart Healthcare: Technologies, Challenges, and Opportunities

Review Based Project Literature Review (Secondary Research) Template
Student's Name and CSU ID
Project Type Review Based Project
Project Name Internet of Things for Smart Healthcare: Technologies, Challenges, and Opportunities
Technology Remote health monitoring system, sensory technology
Techniques The conditions of the patients are monitored using the health monitoring systems, the physiological condition of
the patients can be also tracked using the sensory technologies.
Domain Healthcare industry
NOTE: Please you need to use YOUR OWN WORDS in writing this template.
Version 1.0 _ Week 1 (5 Journal Papers from CSU Library)
1
Reference in APA format that will be
in 'Reference List'
Herbert, R., Kim, J. H., Kim, Y., Lee, H., & Yeo, W. H. (2018). Soft material-enabled, flexible hybrid
electronics for medicine, healthcare, and human-machine interfaces. Materials, 11(2), 187.
1

(This give the Reference of the
Journal Paper you are working on it)
Citation that will be in the content (Herbert et al., 2018)
URL of the Reference Level of Journal (Q1, Q2, ...Qn) Keywords in this Reference
https://doi.org/10.3390/ma11020187 Q1 soft materials; flexible hybrid electronics; wearable
electronics; stretchable electronics; medicine;
healthcare; human-machine interfaces
The Name of the Current Solution
(Technique/ Method/ Scheme/
Algorithm/ Model/ Tool/ Framework/
... etc )
The Goal (Objective) of this Solution &
What is the Problem that need to be
solved
What are the components of it?
Technique/Algorithm name: Flexible
hybrid electronics (FHE),
Tools:
1. Sensing Materials like Carbon
Nanotube, Graphene, Hydrogel,
Liquid Metal (EGaIn),
Nanosheet and Thin Film
(MnO2, Mn, Mg, Si), Nanowire
(Ag, ZnO, Si, Au, BaTiO3, Ni),
Conducting Polymer
(PEDOT:PSS)
2. Substrate Materials like Silicone
elastomer (Ecoflex 00-30),
Problem:The conventional electronic
systems that are made of bulky and rigid
materials are difficult to wear and create
lot of discomfort.
Goal: Flexible hybrid electronics (FHE),
designed in wearable and implantable
configurations, have enormous
applications in advanced healthcare, rapid
disease diagnostics, and persistent human-
machine interfaces. Soft, contoured
geometries and time-dynamic deformation
of the targeted
tissues require high flexibility and
1. Sensing materials
2. Substrate materials
3. Wearable FHE
4. Implantable FHE
2

Silicone elastomer (Sylgard
184), Silicone elastomer
(Silbione LSR 4330), Parylene
(VSI Parylene C), Polyethylene
terephthalate
(PET), Polycaprolactone (PCL),
Polyimide (PI), Polyethylene
naphthalate (PEN),
Polyethersulfone (PES),
Polytetrafluoroethylene
(PTFE), Poly(lactic-co-glycolic
acid) (PLGA), Cyclic olefin
polymer (Zeonor 1020R), Silk
fibroin
3. Wearable FHE of different
sensor types like Strain Sensor,
Pressure Sensor, Light Sensor,
Temperature, Sweat Sensor,
Electrode, Antenna, QD
Display, Cooling Device,
Supercapacitor
4. Implantable FHE of device type
Electrode, Cardiac Temperature
Sensor, Optogenetic Light
Delivery, Biodegradable
Microsupercapacitor,
Biodegradable Battery, Energy
Harvester
stretchability of the integrated
bioelectronics. Recent progress in
developing and engineering soft materials
has provided a unique opportunity to
design various types of mechanically
compliant and deformable systems. The
paper explores new application areas for
materials.
3

Applied Area:
The Process (Mechanism) of this Work; The process steps of the Technique/system
Process Steps Advantage (Purpose of this step) Disadvantage (Limitation/Challenge)
1 Integration Strategies of Electronic Circuits
for FHE. Is mentioned in subsequent steps.
While these soft materials enable FHE to
achieve multiple levels of mechanical
compliance, they alone cannot realize fully
functional and practical FHE.
Core electronic components such as
amplifiers, analog-to-digital converters,
filters, microprocessors,
memories, and multiplexers need to be
embedded into a soft FHE for data
acquisition, transmission,
processing and active control.
No challenge defined
2 1. Organic Electronics : Since most
organic materials can be processed in
a solution form, alarge-scale
fabrication can be done by printing
processes. In fully printed organic
systems, the devices are formed by
an additive manufacturing, thus no
further subtractive steps are needed
for structural patterning.
Despite the manufacturing flexibility
and scalability of organic electronics, a
complete realization of
modern electronic requirements solely
by the use of organic materials has been
challenging. First of all, acquiring
electronic functions with fast switching
speeds and high on-off ratio might be
challenging
4

2. Inorganic Electronics : While typical
semiconducting wafers are rigid and
brittle, exfoliating them into thin
layers with a thickness less than 25
m yields mechanical bendability and
flexibility.
Therefore, an implementation of thin,
single crystalline semiconductor layers
into flexible substrates would provide
superb electronic properties, mostly
owing to the carrier mobilities that are
orders of magnitude higher than those of
organic counterparts, allowing the
circuits to be tasked with more
demanding functions. Moreover, since
modern photolithography technologies
would be used for patterning, extremely
dense array of transistors can be packed
in a small area.
due to the far less carrier mobilities of
organic semiconductors than that of
inorganic, single crystalline
semiconductors. This limits the roles of
organic electronics to low-speed tasks.
Moreover, both structural and chemical
stability of the organic materials needs
to be further improved to achieve the
evice reliability, especially for body-
implantable applications.
3 Thinned Chips : Rather than exfoliating a
thin layer of a wafer, diced individual silicon
chips can be chemically and mechanically
ground down to achieve required
mechanical properties. The thinned chips
can then be bonded to flexible substrates
either with the active side facing down to the
pre-patterned fan-out traces using
conductive adhesives or with the active side
facing upward followed by spin-on film
No data No limitation
5

deposition and establishing electrical
connections via microfabrication.
4 Chip-Scale Packaging : Multiple
components, such as thick-film passive
components and other solderable packages
based on surface mount technology, can be
assembled simultaneously by using an
automatic pick-and-place tool.
The key features enabling this particular
solderable and stretchable
platform are (1) excellent solderability and
compatibility with conventional surface
mount technology,
(2) ability of the assembled device to be
directly integrated with a soft adhesive
layer, and (3) scalability of the
manufacturing method
5 Human-Machine Interfaces (HMI
Validation Criteria (Measurement Criteria)
Dependent Variable Independent Variable
There is no result section as it is a review of some components There is no result section as it is a review of some components
6

Input and Output Critical Thinking: Feature of this work, and
Why (Justify)
Critical Thinking: Limitations of the
research current solution, and Why
(Justify)
Input (Data) Output (View)
N/A N/A
It is a review paper justifying the utility of
soft functional materials in wearable devices. In
this review, soft materials and designs for
sensing and substrate components, along with
the facilitated electronics and applications,
have been summarized. Silicone elastomers and
other soft, organic substrate materials, such as
silk fibroin, have resulted in increasingly
flexible and stretchable electronics, improving
device functionality and increasing the breadth
of potential applications. Additionally, a
number of these materials have indicated
necessary biocompatibility and
biodegradability, allowing for applications in
transient electronic needs. Likewise, sensing
materials, such as CNTs, graphene, hydrogels,
and nanostructures, have improved the
mechanical and electrical characteristics of
FHE. Sensing materials generally limit the
mechanical compliance, but integration with
soft substrates and recent advances have
improved mechanical properties while
maintaining favorable electrical properties.
These advancements in soft material-enabled
wearable and implantable electronics have
improved functionality and allowed
To continue progress in the advancement of
wearable and implantable FHE, a variety of
challenges and opportunities is still being
addressed. Further development of soft
material-based sensing components is required
to offer smaller form factors of functional
devices. New addition of self-healing
materials will expand the current mechanical
and application limits of FHE. For hard-soft
device configurations that combine both
compliant elastomers and rigid electronic
components, advanced manufacturing
methods are needed to provide robust
mechanical and electrical hybridization of two
types of materials. Improved technologies of
multi-scale integration of hybrid materials will
reduce the current gaps in performance
variation between materials. While currently
limited, further development of miniaturized
and more efficient wireless powering and
communication technologies will allow
continuous and long-term usage of wearable
and implantable systems. Additionally,
continued investigation of biodegradable
materials will broaden the applicability of
transient electronics for implantable systems.
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applications in different areas, including
healthcare, disease diagnostics, and human-
machine interfaces.
Direct coupling of soft devices with cells and
tissues will improve in vivo interfaces.
Moving forward, continued development and
integration of soft, functional sensing and
substrate materials will heighten the
functionality and applicability of FHE.
(Describe the research/current solution) Evaluation Criteria How this research/current solution is
valuable for your project
What is the Future work that set by the
author in Conclusion and Future work
section
Health Monitoring and Disease Diagnostics
Diagram/Flowchart
Reference in APA format that will be in 'Reference List'
(This give the Reference of the Journal Paper that the author selected and improve it (State of art of his work))
 Xu, S., Zhang, Y., Jia, L., Mathewson, K. E., Jang, K. I., Kim, J., ... & Bhole, S. (2014). Soft microfluidic assemblies of sensors, circuits,
and radios for the skin. Science, 344(6179), 70-74.
 Norton, J. J., Lee, D. S., Lee, J. W., Lee, W., Kwon, O., Won, P., ... & Umunna, S. (2015). Soft, curved electrode systems capable of
integration on the auricle as a persistent brain–computer interface. Proceedings of the National Academy of Sciences, 112(13), 3920-
3925.
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