Manufacturing process Assignment

Running Head: MANUFACTURING PROCESSES
Manufacturing Processes
Name
Institutional affiliation

MANUFACTURING PROCESS 2
Manufacturing Processes
This research paper discusses quality characteristics of products, principle determinants of the
geometry of the parts, how the components are made, key process parameters, variables used
to control the processes, variables expected to cause variation in the output, how the
processes are controlled, and discussion of the advanced topics in manufacturing processes.
Problem 1
Quality Characteristics
The key quality characteristics of the fuselage skin panel are a major consideration
and the key measurements of the output geometry that should be considered include the
diameter and the output constituent properties.
Output Geometry
Some of the output geometry measurements that would be considered when dealing with
cantilever-beam MEMS accelerometer include:
 Side angles
 Thickness
 Length
 Width
Output constitutive properties
These properties are the function of mass and stiffness which are functions above constitutive
properties and geometry. The output constitutive properties that should be considered by the
customer when dealing with fuselage skin panel and cantilever-beam MEMS accelerometer
include:
 Resonant frequency
 Density
 Young’s modulus
Fuselage skin panel

MANUFACTURING PROCESS 3
Some of the output geometry measurements that would be considered when dealing with
fuselage skin panel include:
 Strength
 Thickness
 Weight
 Length
 Width
Output constitutive properties
These properties are the function of mass and stiffness which are functions above constitutive
properties and geometry. The output constitutive properties that should be considered by the
customer when dealing with fuselage skin panel include:
 Density
 Tensile strength
 Ductility
 Brittleness
 Young’s modulus
 Tension
How the Component is made
Cantilever-beam MEMs accelerometer
Photolithography: Chrome mask is used in this case which is a patterned wafer with
photoresist and then applying Ultra Violet light to harden the resist. The resist mask is then
used to pattern the oxide mask. The oxide mask is used to wet the etch silicon in the next
stage. The process of lithography is used in determining the top planer dimension of the
sections mainly the length and width.
Wet chemical etching: Etch with Potassium Hydroxide (KOH) for anisotropic etching of
silicon is used in this case. The endpoint is then determined during the release of the
cantilever, over-etching can still apply due to anisotropic. The wet etch contributes basically

MANUFACTURING PROCESS 4
to the z-direction geometry of the section since angles of the sidewall are determined by the
etchant used and the orientation through crystallography of the silicon substrate.
Principal Determinant
The Young’s modulus and density are functions of the bulk silicon and also independent of
the process. However, since density and stiffness are also functions of the volume, and are
therefore geometry, they are affected by etching chemical/time and lithography.
Fuselage skin panel
Sheet forming: This process is done by working the material into thin and flat pieces.
Normally the sheets are rectangular and flat and they need to be designed into the shapes
required according to the quality characteristics of the component. The processes that are
undertaken during the sheet forming include shearing process, forming process, and finishing
process.