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MEMs

   

Added on  2019-09-26

5 Pages1086 Words95 Views
Running Head: MEMsMEMS

MEMs1PART 1 ANSWER A: In both the papers etching is used because of its versatile nature as the MEMsfabrication processes but the difference is that in the paper silicon as a mechanical material, otherprocesses are also used with the process of etching like epitaxial process, thermo-migrationprocess and field assisted thermal bonding process because the purpose is to alter the prevalentperception of miniature components. Whereas in the bulk paper micromachining of silicon, wetetching is used with different phases like isotropic wet etching, vapor-phase etching, and plasma-phase etching because the purpose is to remove the eloquent amount of silicon. ANSWER B: the applications which are highlighted in the paper bulk micromachining siliconare usage of interhalogen etches, method of high aspect ratio dry etching and the applicationswhich are highlighted in the paper silicon as a mechanical material are the continuousdevelopment of mechanical material, fabrications are being taken from the industry ofsemiconductor, processing techniques of low temperature like plasma-phase etching, disk storagetechnology, IC fabrication for the laser etching. Therefore, the given applications are beinghighlighted in both the papers.ANSWER C: The applications in both the papers differ because in the bulk papermicromachining of silicon wet etching is used as a method of fabrication process because thepurpose is to remove the eloquent amount of silicon from substrates, so the applications are usedaccording to their techniques. Whereas in the paper silicon as a mechanical material differentprocess of etching are used in order to alter the prevalent perception of miniature components, sothe applications are used accordingly. And the difference is reflected in the manufacturingprocess because their objective or purpose are different which they want to achieve.ANSWER D: The most promising application for MEMs in 2014-2020 can be the growth inthe ‘global automotive’ MEMs sensors. It is expected that by the year 2020, it will expandaround four percent in market coverage (Electroiq.com, 2016). Moreover, it is expected thatMEMs will cover all the five senses, namely, sight (Image sensor, mirco-displays), balance(Inertial devices), hearing (microphones), smell (Gas Sensors), taste (Humiditiy sensors andelectronic tongue), pressure (pressure sensors), and touch (force and touch sensors) (BoschSeminar, 2015).

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