CE 2.1 Project Description and Characteristics of the Project: Design and Fabrication of Image and Signal Processing Location

CE 2.1 Project Information
Name of the project: Design and Fabrication of Image and Signal Processing
Location of the project: Eastern Mediterranean University (Turkey)
Project Duration: Please fill
Organization: Eastern Mediterranean University (Turkey)
Role and Designation during the time: Team Member of the project
CE 2.2 Project Background
CE 2.2.1 Characteristics of the project
Signal and image processing concern with the proper analysis, synthesis as well as
modification of several signals and images. During this project of Design and Fabrication of
Image and Signal Processing I made the design of the various signals and images. I developed
the complex applications like images, signals, and the control processing by broadly sub dividing
into three important steps. I noted that the first step was the study of theoretical abstract of the
algorithm, the second step was the research of the targeted architecture, and final step was proper
implementation. I took up several architectures with this particular design methodology on the
basis of several dedicated coprocessors and processor cores to achieve the required efficiency. I
have implemented both ASIC and the FPGA and hence during the fabrication process, proper
outcome was obtained. After proposing a compact design for the project, I was engaged with the
simulation process. I even compared the various test results before evaluating the efficiencies of
the expected results.

CE 2.2.2 Objectives developed for the project
In this project of Design and Fabrication of Image and Signal Processing, the most
significant area in this type of processing, is designing. Audio signal processing as well as the
digital signal processing were the main application fields in signal processing. For the image
processing, I have identified some of the major techniques like hidden Markov models, linear
filtering, pixelation and many more. While executing this particular project with better
efficiency, I have identified the following objectives:
 To develop image and signal processing.
 To fabricate the signal processing in respect to audio and digital signals.
 To reduce the complexity of processing of image and signals.
 To utilize popular techniques like linear filtering, pixelation and hidden Markov models.
 To blur or sharpen the digital images by using digital filters.
CE 2.2.3 My Area of work
I had to learn about the several techniques of image and signal processing with the help
of various techniques. Thus, before starting my area of work, I made sure that I have gained
enough knowledge regarding image processing and signal processing. Therefore, I researched
about the various techniques of these processing and eventually got the idea that pixilation is
considered as the most efficient technique for digital image processing. I even proposed a
complete design for this particular project and fabricated the project after taking proper readings
from the previous experiments. Reviewing various results was my next area of work. Moreover,
I have also utilized the selected techniques perfectly in this particular project and thus was
successful in providing expected outcomes.

CE 2.2.4 Project Group
Figure 1: People included in the project
CE 2.2.5 My responsibilities throughout the project
I was assigned for the vital work of providing a compact design to this project. For this
purpose, I had to understand the core concept of circuit designing. I even had to undergo
periodical experiments for reutilizing the existing assets of the particular static architecture. I had
to use back projection algorithm in this project for properly evaluating the results. My other
important responsibility includes calculations of pixels with the huge parallel architectures. I
built the chip of 64 × 64 pixel proof concept, on the standard CMOS process of 35 μm, with size
of 35 × 35 μm for depicting the project effectively. I also selected the chip for executing the
project simulation. This chip had the capability to capture until 10000 images and to process
until 5000 images in one second.