This project analyzes heat transfer and fluid dynamics using ANSYS Fluent software to determine the optimal configuration of fins for cooling electronic devices. The assignment involves modeling three different fin configurations within a box with an air inlet and outlet, applying a heat flux of 100W to the fin surfaces. The student uses CFD analysis, including meshing, setup, and result interpretation, to evaluate temperature distribution and velocity streamlines for each configuration. The report details the methodology, including geometry modeling in SolidWorks, meshing parameters, boundary conditions, and material properties. The results, presented as temperature contours and velocity streamlines, are then compared to identify the configuration that provides the lowest temperatures and most efficient heat transfer. The project follows Newton's law of cooling and explores how fin surface area influences heat dissipation, aiming to find the most effective design for thermal management.
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