Manufacturing Processes Analysis: Component Quality and Production

This report analyzes various manufacturing processes, focusing on the quality characteristics of components like fuselage skin panels and cantilever-beam MEMS accelerometers. It delves into how these components are made, detailing processes such as photolithography, wet chemical etching, sheet forming, edge trimming, and rivet hole drilling. The report examines key process parameters, control variables, and their impact on output sensitivity. It also explores process control methods used to ensure desired component dimensions and properties. Furthermore, the report discusses advanced topics, including 3D printing and nanomanufacturing, covering principles, applications, and their significance in modern manufacturing. The report provides a comprehensive overview of manufacturing techniques and their implications in different sectors.

Running Head: MANUFACTURING PROCESSES
Manufacturing Processes
Name
Institutional affiliation

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Manufacturing Processes
This research paper discusses quality characteristics of products, principle determinants of the
geometry of the parts, how the components are made, key process parameters, variables used
to control the processes, variables expected to cause variation in the output, how the
processes are controlled, and discussion of the advanced topics in manufacturing processes.
Problem 1
Quality Characteristics
The key quality characteristics of the fuselage skin panel are a major consideration
and the key measurements of the output geometry that should be considered include the
diameter and the output constituent properties.
Output Geometry
Some of the output geometry measurements that would be considered when dealing with
cantilever-beam MEMS accelerometer include:
 Side angles
 Thickness
 Length
 Width
Output constitutive properties
These properties are the function of mass and stiffness which are functions above constitutive
properties and geometry. The output constitutive properties that should be considered by the
customer when dealing with fuselage skin panel and cantilever-beam MEMS accelerometer
include:
 Resonant frequency
 Density
 Young’s modulus
Fuselage skin panel

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Some of the output geometry measurements that would be considered when dealing with
fuselage skin panel include:
 Strength
 Thickness
 Weight
 Length
 Width
Output constitutive properties
These properties are the function of mass and stiffness which are functions above constitutive
properties and geometry. The output constitutive properties that should be considered by the
customer when dealing with fuselage skin panel include:
 Density
 Tensile strength
 Ductility
 Brittleness
 Young’s modulus
 Tension
How the Component is made
Cantilever-beam MEMs accelerometer
Photolithography: Chrome mask is used in this case which is a patterned wafer with
photoresist and then applying Ultra Violet light to harden the resist. The resist mask is then
used to pattern the oxide mask. The oxide mask is used to wet the etch silicon in the next
stage. The process of lithography is used in determining the top planer dimension of the
sections mainly the length and width.
Wet chemical etching: Etch with Potassium Hydroxide (KOH) for anisotropic etching of
silicon is used in this case. The endpoint is then determined during the release of the
cantilever, over-etching can still apply due to anisotropic. The wet etch contributes basically

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to the z-direction geometry of the section since angles of the sidewall are determined by the
etchant used and the orientation through crystallography of the silicon substrate.
Principal Determinant
The Young’s modulus and density are functions of the bulk silicon and also independent of
the process. However, since density and stiffness are also functions of the volume, and are
therefore geometry, they are affected by etching chemical/time and lithography.
Fuselage skin panel
Sheet forming: This process is done by working the material into thin and flat pieces.
Normally the sheets are rectangular and flat and they need to be designed into the shapes
required according to the quality characteristics of the component. The processes that are
undertaken during the sheet forming include shearing process, forming process, and finishing
process.

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Figure 1: Sheet forming process
Edge trimming: This method is applied to bonded wafer assemblies and is performed to
remove a small amount of diameter on the component wafer but not the carrier wafer. This
removes the narrow edge area of the component wafer where bonding voids may normally
happen thus reducing the area that is most likely to suffer chipping.
Figure 2: Edge trimming by shearing process
Rivet hole drilling: This process is done by a standard twist drill this prevents binding of the
rivet in the hole. The position of the rivet holes should be centre punched and the drilling
performed by the use of power drill either pneumatic or electric.
Principal Determinant
The ductility, brittleness, Young’s modulus, and tension are functions of the bulk silicon and
also independent of the process. However, since density and stiffness are also functions of the

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volume, and are therefore geometry, they are affected by rivet hole drilling and edge
trimming processes.
Process Parameters
The process parameters used to make both the components are listed below:
Cantilever-beam MEMS accelerometer
Wet chemical etching
Equipment state: Time of KOH, temperature, concentration
Equipment properties: KOH etch rate a function of time, temperature, and concertation.
Material states: KOH product, silicon, Bulk silicon
Material properties: Mask material, the silicon type, crystallographic
Photolithography
Equipment state: Time of exposure, power density tool, UV on/off
Equipment properties: UV power density dependence on time/temperature
Material states: Cured/developed polymer, exposed polymer, the prepolymer
Material properties: Catalytic density, viscosity
Fuselage skin panel
Sheet forming
Equipment state: shape changes, thinning, cracking,
Equipment properties: Ductility, tensile strength, temperature, flexibility
Material states: Aluminium alloy, steel, titanium

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Material properties: Brittleness, ductility, shear strength
Edge trimming
Equipment state: Tolerance, deep drawing, bending, cutting, bending
Equipment properties: Strasbaugh 7AF, Strasbaugh 7AA and Disco 850 back grinders.
Material states: Semiconductor substrates, SiC, Sapphire
Material properties: Sharp edge, slightly misaligned,
Rivet hole drilling
Equipment state: Rivet size, drill number, drill size,
Equipment properties: Tensile strength, size, chuck size
Material states: Semiconductor substrates, SiC, Sapphire
Material properties: Strength, texture, density, dimension
Control Variables
Cantilever-beam MEMS accelerometer
Photolithography: Develop spic speed. Develop time, softbake temperature, softbake time,
exposure time
Wet chemical etching: Etch time, chemical bath temperature, etchant concentration, the
chemical etchant
Fuselage skin panel
Sheet forming: Shearing forces, required shapes, fracture,
Edge trimming: Diameter, wafer breakage, size of the edge

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Rivet hole drilling: Rivet diameter, drill number, drill size
Output sensitivity to control variables
Cantilever-beam MEMS accelerometer
Photolithography: Develop spin speed, develop time, softbake temperature, softbake time,
exposure time, all these affect the length and width of the oxide mask used to etch the
cantilever. The Cantilever alignment to the orientation of crystallography also affects the
length and width due to the sensitivity of each plane.
Wet chemical etching: Etch time, chemical bath temperature, etchant concentration, the
chemical etchant, all change the thickness of the cantilever and to a cantilever of smaller
degree.
Fuselage skin panel
Sheet forming: Perforation, slitting, slitting, notching, and lancing all effects the shapes of the
final sheet that would be used in the manufacturing the component.
Edge trimming: Substrate edge, edge trim, wafer assemblies
Rivet hole drilling: The rivet diameter, drill number and drill size affects the speed of the gun
Process control
Cantilever-beam MEMS accelerometer
Photolithography: The coupling of the mechanical kinematic with wafer flat is used for
process control by ensuring that mask is aligned with the orientation of the crystal that is
desired, checking the process history for the best recipe for develop time/speed, bake
time/speed, and exposure time.

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Wet chemical etching: Etch time, chemical bath temperature, etchant concentration, and
chemical etchant.
Fuselage skin panel
Sheet forming: Mechanical behaviour and plastic deformation are used in the process control
by ensuring that the sheet is at required dimensions according to the required component.
Edge trimming: edge trim, edge chopping and wafer breakage are used in the process control
by ensuring that the edge to be trimmed has attained the required component edge.
Rivet hole drilling: The rivet diameter, drill number and drill size affects the speed of the gun

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Problem 2
3D (Three-dimensional) Printing
Three-dimensional refers to the process by which material is solidified or joined under
computer control to form an object in three dimensions, with the addition of materials
together like fusing together powder grains or liquid molecules. Three-dimensional printing is
used in both additive manufacturing (AM) and rapid prototyping. The objects can be of any
geometry or shape and normally are produced by the use of digital model data from a model
of 3D or another source of electronic data such as Additive Manufacturing File. The
following are the general principles of 3D Printing:
Modelling: The models of three-dimension can be produced by the use of photogrammetry
software, digital camera, 3D scanner and a Computer Aided Design package. Printed models
of 3D generated by the use of CAD result in fewer errors and can be rectified before printing,
enabling verification in the object design before printing (Busnaina, 2014). The manual
process of modelling of preparation of geometric data from 3D graphics of computer has
some similarities with the arts like sculpting. The scanning of 3D can be defined as the
process of digital data collection on the appearance and shape of an actual object, producing a
model that is digital based on it.
Printing: Before a 3D model is printed from stereolithography file, it should initially be
examined with errors. Majority of applications of CAD generates errors in output STL files,
these errors include noise shells, face normal, and holes. There is a step in generation of STL
known as repair which fixes the errors in the actual model. After the completion, there is need
of the STL file to be processed by a slicer which is a piece of software that converts the
model into series of layers that are thin and generates a file of G-code which has instructions
directed to a give 3D printer type.

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Fishing: Despite a resolution produced by the printer being enough for numerous
applications, printing a slightly a version that is oversized of the object desired in standard
resolution and then removing material with a substrate process of higher resolution may
attain a greater accuracy (Evans, 2016). Some polymers like ABS enable the fishing of the
surface to be improved and smoothed by the use of process of chemical vapor based on
acetone or other solvents similar to it. Some techniques of additive manufacturing have the
ability of utilizing numerous materials in the process of constructing sections. These methods
have the ability to print colour combinations and multiple colours simultaneously and would
not need painting necessarily.
There are numerous available additive processes. The major difference between the
processes are in the manner in of layer deposition and in the materials used. Every method
has its own drawbacks and advantages, which is why the majority of the companies provided
of polymer and powder for the material selection when building the object. The 3D printing is
currently being used in sociocultural, industry, medical, manufacturing sectors which enable
3D printing to become an effective technology (Huang, 2015).
Nanomanufacturing
Nanomanufacturing can be defined as the manufacturing of parts top-down or bottom-
up from materials that are nanoscaled on the production of nanoscaled materials which can be
fluids or powders in minute stages of high precision, used in numerous technologies like
etching and laser ablation. These manufacturing processes results in nanotechnology,
systems, features, structures, and extreme devices that have uses in physics, aerospace
engineering, molecular biology, and organic chemistry (Huang, 2015).
Nanomanufacturing facilitates the production of new products and material that are
applied in lithography, electrostatic coating, medical devices, device assembly, and material

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removal processes. National Nanomanufacturing Network is a Nanomanufacturing program
that works to expedite the transition of nanotechnologies from the research in the laboratory
to manufacturing in production and it undertakes this by roadmap development, strategic
workshops, and information exchange (Jackson, 2012). The organization of National
Nanomanufacturing Network works to speed up the transition of nanotechnology from the
research in laboratory to production manufacturing and this is attained by roadmap
development, strategy workshop, and information exchange.
Atomic Layer Deposition which is abbreviated as (ALD) is a technology of Nano-
scale manufacturing by the use of chemical vapour deposition and bottom-up methods of
manufacturing for sustainability point of view. The Atomic Layer Deposition replaced silicon
oxide dielectric film with aluminium oxide dielectric film. The Atomic Layer Deposition
industry is currently using semiconductor industry and promising in polymer, sensor, medical
devices, fuel cells, and solar cells. The technology of Nanomanufacturing has enabled the
improvement in packaging of food by improving the barrier in plastic material which enables
the identification of relevant information by customers.
The performance of the traditional materials for construction namely concrete and
steel has been improved through nanotechnology. The reinforcement of concrete with metal
oxide nanoparticles increases the strength minimizes the permeability of the construction
material. The Property of Young’s modulus and tensile strength of Nanocarbon additives like
Carbon nanofibers and Carbon nanotubes has led to the creation of materials that are porous
and denser (Lipson, 2011).
Nanomanufacturing is normally divided into two groups namely bottom-up and top-
down approaches. Nanoscale Offset Printing System which is abbreviated as NanoOps is an
example of such technologies which is a form of directed assembly that is more economical