Applications of Microtronic Eagleview 5 and Its Technology: A Report

This report provides a detailed overview of the applications of Microtronic's new Eagleview macro defect inspection system. It explores the system's capabilities beyond wafer defect inspection, encompassing dicing inspection, photomask inspection, die inspection, and BGA inspection. The report highlights the system's functionality in each application, including the use of specific wavelengths for accurate analysis and the benefits of high-resolution imaging. Furthermore, it discusses the advantages of the Eagleview system, such as high accuracy, automation leading to cost reduction, speed, reliability, consistent results, high performance, and ease of integration. The report also references the sources that provide further information on the system and its applications in the semiconductor industry.

Applications of the
New Microtronic
Eagleview 5 and its
technology
2018
A MACRO DEFECT INSPECTION SYSTEM
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1 Applications of Microtronic’s New Eagleview Macro Defect Inspection
System and its technology
Apart from the minute inspection of wafer defects, this system can also be used for many
other similar purposes as below,
1.1 Dicing inspection
Dicing is defined as the process in which the die is removed from the wafer. After this
process the processing of the wafer is performed. The minute defect capturing capability
helps to record and analyse each sector of the wafer. The wavelength of the light chosen is
such that it is of the order of the band gap of the semiconductor material used. Graph is
generated after multiple scanning at multiple depths. This ensures accuracy. Scribing and
cutting by LASER is performed, after which the diced wafer is mounted on the carriers
making them ready to be used in the electronic devices (ES Components, 2017).
1.2 Photomask inspection
In this process the photomasks are inspected closely and accurately because they have to be
made completely ready for semiconductor fabrications. The deformities of the photomasks
around the edges are noticed using powerful beam of light, incident on it. It is typically
around 538 nm wavelength. The dark and bright incident as well as transmitted fields helps in
observing the holes, impurities and deformations (Photo Sciences Incorporated, n.d.).
1.3 Die inspection
Dice inspection involves the correctness of the defects introduced on the dice during
handling, dicing or any other external activity. High resolution images are mapped to find
these abnormalities and correct them so that the efficiency and the yield is not affected. The
electro-microscopic devices identifies the bumps accurately (Semiprobe, n.d.).
1.4 BGA inspection
BGA inspection involves the identification of solder defects which cannot be seen from the
naked eyes properly. In SMD soldering techniques many times it is uncertain whether the
joint is properly established or not. Once the Printed Circuit Board (PCB) is installed in the
electronic devices, at the time of operation if the performance is decreased then it becomes

tedious to start over again. So, in the first stage itself those defects can be observed and
accordingly moved to the re-soldering department and the issue can be easily resolved. 3D
imaging further improves the ease and it is less expensive than x-ray systems as well (Caltex
Systems, n.d.).

2 Advantages
 High level of accuracy that cannot be achieved through manual inspection can be
easily achieved.
 Automation decreases the need for workers and hence cuts the costs.
 Fast.
 Reliable.
 Delivers consistent results without any compromise to the yield.
 High performance.
 Does not require any time consuming recipe and hence their maintenance.
 It can find out the root cause of the defect through the huge data maintained after
comparing and analysing with each other.
 Easy to integrate with the pre-semiconductor inspecting machinery.

References
Caltex Systems (no date) BGA Inspection [Online]. Available from:
http://caltexsystems.com/products/bga-inspection-system/ [Accessed 4 October 2018].
ES Components (2017) Tell Me – What Is Wafer Dicing? [Online]. Available from:
https://www.escomponents.com/blog/2017/9/26/tell-me-what-is-wafer-dicing [Accessed 4
October 2018].
Photo Sciences Incorporated (no date) Photomask Inspection [Online]. Available from:
https://www.photo-sciences.com/photomask-inspection/ [Accessed 4 October 2018].
SemiProbe (no date) Wafer & Die Inspectio. [Online]. Available from:
https://www.semiprobe.com/applications/wafer-die-inspection/ [Accessed 4 October 2018].