Comparative Study on Multichannel and U-Shaped PCB Assembly Layout

This report presents a comparative study on multichannel and U-shaped assembly layouts for PCB (Printed Circuit Board) assembly lines, utilizing Flexsim simulation software for educational purposes. The study delves into the literature review of PCB assembly, including the steps involved in the simulation process for both Insertion Mount Technology (IMT) and Surface Mount Technology (SMT). The report explains the application of Flexsim for modeling and simulating assembly lines, emphasizing the software's capabilities in creating 3D-based models for various manufacturing processes. It highlights the significance of simulation in the design and optimization of PCB assembly lines, including cost and time analysis. Furthermore, the report explores the use of simulation for educational purposes, emphasizing the benefits of simulated learning activities in engineering and related fields. It also discusses the historical use of simulation in training, highlighting examples from aviation and healthcare, and explores the integration of computer-based games in training and education. The report aims to provide a comprehensive understanding of PCB assembly processes and how simulation can be leveraged to improve design efficiency and overall system performance.

Dissertation
1

Table of Contents
Topic: Comparative Study on Multichannel and U-Shaped Assembly Layout of PCB Assembly
using Flexism Simulation for Educational Purpose.........................................................................3
Literature Review.............................................................................................................................3
Introduction..................................................................................................................................3
Steps for simulation.....................................................................................................................3
.....................................................................................................................................................5
Simulation for educational purpose.............................................................................................9
Performing cost analysis for assembly lines..............................................................................13
Performing time analysis for assembly lines.............................................................................16
Significance in simulation of PCB assembly lines....................................................................18
Significance of finding efficiency of assemble line layout.......................................................22
Conclusion.....................................................................................................................................25
REFERENCES..............................................................................................................................26
2

Topic: Comparative Study on Multichannel and U-Shaped Assembly Layout
of PCB Assembly using Flexism Simulation for Educational Purpose
Literature Review
Introduction
Printed circuit boards or PCBs are unsung heroes present in modern electronic devices,
which are designed to help new as well as seasoned engineers, to make better informed decisions
in fewer periods, to end up with appropriate and perfect components for product development.
As fundamental characteristic, of competitive environment in today’s world includes the
requirement of shorter product life cycles as well as increased demands for the customization (Jo
and Kim, 2018). But as these aspects seems to be difficult for satisfying operating via traditional
production lines. Therefore, JIT U-lines development is being the emerging response for
competing in such competing environment. The present literature review describes the
simulation utilization to guide the efforts for improvement while redesigning the PCB assembly.
A comparative study is done on U-shaped and multichannel layout of this assembly, by using
flexism simulation in educational purpose. The study is done to understand the PCB assembly
process by using simulation with flexism approach. To improve the overall performance of
system, feasibility of flow logic process is assessed, including impact of changing line
configuration.
Steps for simulation
Simulation of the electronic circuit mostly uses a number of mathematical models for
getting the actual behaviour of electronic devices like PCB (Printed circuit board). Simulation
software helps in modelling the electronic circuit operation. Through research, it has been
evaluated that before manufacturing, simulating the circuit behaviour helps in improving and
increasing the design efficiency. PCB designing which requires modelling like IBIS models,
transmission lines etc. so, simulator includes schematic editor, waveform display, simulation
engine and more, that monitors the effect also which may occur during operation. PCB or printed
circuit board assembly lines are mainly fall within serial production line general category. But
common problem that might be faced by engineers during designing configuration of future or
existing lines for meeting targeted production rates. Therefore, simulation modelling helps in
capturing the complex behaviour as well as interaction among various components of assembly
3

lines of PCB (Jiao and et. al., 2018). In this regard, before simulation, it is essential to analyse
process of simulation, which is mainly classified into two broad categories as per components
type viz. Insertion Mount Technology (IMT) and Surface Mount Technology (SMT). Hereby, six
steps are used in simulation of SMT as First step – Attachment Media Dispensing; Second step –
Component Placement; Third Step – Curing; Forth Step – Soldering; Fifth Step – Cleaning: and
last or Sixth Step – Testing. General Steps involved within SMT process for assembling the PCB
are explained as below –
Furthermore, steps involved within simple simulation includes –
Input analysis – this step include collection as well as analysis of data, with validation of
conceptual model
Model development – this step involves development of simulation model, by following out
verification and validation of required simulation model
Output analysis – performance metrics of system are analysed and determined in this step.
4

FlexSim refers to a discrete event simulation software package, which is developed by
FlexSim Software products. This powerful software helps in providing tools to develop 3-D
based simulation models, for producing, deposit, material handling and flow processes. Flexsim
model can be built by dragging as well as dropping objects into model view, then write materials
into dialogue box as shown in below figure:
Set targets No
Collect data
Build system model
Build simulation model
Model Validation
Yes
Simulation and running
Analyse the result
Simulation through above analysis, considered as an essential process for designing any
component or electronic device. In context with PCB, its designing process is mainly done
through Pspice simulator which is available via OrCAD PCB design software. This would
basically help in increasing the manufacturing efficiency by providing the fast preview about
how PCB after designing is going to look, as well as estimating its performance in different
application. If PCB involves any type of functional property such as speed, signals, frequency,
and lower current and so on, then it is essential to integrate the best schematic layout for
5

integrating the system with specific simulation tools. Therefore, by simulating the PCB,
parameters like signal integrity, power delivery, mixed signal simulation and others, can easily
be analysed. Thus, for creating simulation in PCB assembly, it is required to create the
simulation profile first, under which process like selection of analysis type can be done, that can
be refused also when required. Hereby, through creation of simulation profile, editing and
modifications also can be done as per PCB design. Therefore, following steps can be used for
creating simulation profile –
Run Pspice – go to Pspice tap and choose run
A Netlist generation box will appear on screen that indicates each link of entire process
of designing. When whole process of simulation is done, then it will show in output window as –
6

View output waveform –
After simulating the design, next step is to check the output waveform by using Pspice
because examining the circuit performance including its designs, also helps in increasing its
credibility. Therefore, after analysing the different methods, place the circuit design. Now,
OrCAD captures the desirable simulation wave form points, where markers can select from
menu in following way –
7

In this regard, two types of files will show for simulation viz. Pspice output file and
waveform data file, where to configure one of the file, option tab is used as shown beneath –
8

Simulation for educational purpose
Simulations has created the real world process into controlled environment, therefore, in
educational field, it can be used for providing a creative learning environment for learners.
Simulation can be used in various ways, especially for scientific discovery, testing designs for
safety, creating graphics for providing education and more. For providing education in real life
or more visualise manner, a number of activities can be created that helps in promoting effective
learning. Having ambiguous and open-ended features, simulated learning activities encourage
learners for contemplating the scenario implications, by understanding the situation in real
manner and through experimental practices. In the field of engineering, Modelling and
simulation refers to a problem-solving methodology that helps learners in analysing the most
complex systems more easily defines the simulation in engineering as “The process modelling
that mimics response of the real or actual system to events which take place with time”. While
through perception of …, simulation is identified as process of designing a real system model
that helps in conducting a number of experiments for understanding the system behaviour,
through which various strategies can be developed for operating the same and resolve complex
problems. Such model of real system can also be used for analysing the current operations as
well as identifying problem area such bottlenecks, testing different scenarios for making
improvement, designing new manufacturing systems for product development and more.
Simulation models allow learners to test the potential changes within existing system or
evaluating the new design system instead of building it.
Similarly, in the field of manufacturing sector, a number of simulation applications can be
used such as printed circuit board assembly (PCB), wafer fab production, surface mount
technological lines and in other assembly operations. As electronics is considered as the integral
part of daily lives, like smart phones to cars, so, all these things are possible only through PCB. It
is mainly found as small green chips which are covered in lines, made with fiber-glasses, copper
and various metals. PCB or Printed circuit board designs helps in bringing electronic circuits to
life, within physical form. By simulation, this design process combines a number of component
placements and routines, in order to define the electrical connectivity on manufactured board of
circuit. In PCB assembly, it involves total automated assembly lines, manual and semi-manual
etc., where these operations are integrated totally with test operations.
Historical use of Simulation Training
9

The use of simulation throughout training and education brings a lot to
continuing learning in aviation that has more than half a century of knowledge and "learned the
lessons" with computer simulations and visualization. Aviation simulators had already also been
enough to educate working memory given task or multiple tasks, but also activities in the
cognitive aspects over the past couple of decades. Affective-domain preparation was directed at
enhancing employee efficiency and reducing injuries causing mechanical failure. Aviation
outcomes were in virtually eliminating air carrier accidental deaths. For instance, Kohn,
Corrigan, and Donaldson (2000) uphold the gains that aircraft education has achieved since the
Second World War as a framework for many other sectors and several businesses are now
designing more complex training simulators so that staff in areas such as health can get leverage
from simulation learning.
Medical Simulation Training
The healthcare industry is among the largest growing modelling and simulation regions but
has previously been seeing a development in the use of simulation studies and simulation games
for professional development. Such simulators usually have functionalities with the operating
systems that can provide coaching throughout the cognitive function abilities needed for
particular medical interventions. For example, Immersion Medical manufactures an ultrasound
simulator which enables instructors to perform different categories of endoscopic procedures in
an environment is also healthy for the patient, as a simulation patient is being used, and presents
the trainee with input on the activity. As per Lian and Chen (2006), medical study employed not
only strong ecological simulation performance and furthermore haptic simulation. They further
note that "a basic and common application of skilled design, virtual catheter insertion solves
challenging issues like soft tissue simulation, path planning, and force modelling." Their
software uses advanced mathematical algorithms to map characteristic properties for a much
more realistic virtual reality (VR) of body cells and a much more realistic haptic representation
of the person-VR interfaces. It included a logical knowledge set, problem solving and decision-
making capabilities, effective psychosocial interactions, as well as other qualities which can be
evaluated through quantitative tests, such as advisory committee or specialist qualification
examinations. Maybe most important to the physician, though, is the profession’s key
professional skills. A battery of advanced tools is being developed to educate and provide good
arguable of the technological capability of the trainee. In healthcare sectors, the selection of
10

simulators may vary from basic part-task instructors equipped to teach a single assignment to
more complex computer simulations that can perform several activities, just as in aviation. These
ground breaking state-of-the-art modelling tools may be very effective in guiding and testing the
cognitive and psychomotor abilities of student nurses; nevertheless, they can be quickly
misrepresented, over- or under-used, and significantly push up cost of training through sufficient
instruction or practice.
Computer-based Games in Training and Education
Computer-based gaming with basic "score" or human-computer interaction (e.g., games,
geometry wars, etc.) started as mere entertainment. Computer-based gaming’s have evolved at a
very rapid pace from such a time, a trend which has closely exemplified the growth of more
efficient personal computers. Computer-based players are becoming very advanced, as well as a
huge portion of the entertainment market, as demonstrated by products like Halo 3. Such new
state-of-the-art interactive games have used a range of technologies such as: multi-player
asynchronous playing games, haptic feedback, virtual reality and strong visual and audio quality.
Through the advent of computer-based educational games, they started to be integrated as a tool
of training and education to accomplish specific learning goals. Gopher et al., (2014) find the
flight success results for two cadet teams, which got ten hours In following test flights the
preparation was significantly better than someone with no experience of playing. As per Ruben
(2009), computer-based games will provide the ability to learn and exercise expertise or abilities
and obtain an understanding of the fundamental conceptual structures of the perceptions of the
students. ActivChemistry as seen in Figure is an example of a chemistry laboratory’s educational
simulations. This is a mechanical building kit that offers materials and equipment for learners,
like fluorescent lamps, materials, as well as a wide range of measurements and pressure sensors.
Through immersive and creative lessons, students use these elements to conduct experiments,
collect and data types, and experiment with new concepts. Based on the actual devices,
ActivChemistry shows many benefits of using simulation. Such benefits include protection
experiments that are just too risky for most school chemistry laboratories.
11

Simulations are quite useful, as per Shumucker (20099), as they help individual’s student
to discover new ideas and learn a n appreciation of the interplay of dynamic connected
phenomena. Simulation results usually integrate free-play conditions and will provide the student
with expertise in recognizing whether a collection of circumstances communicate. Simulation is
usually a computer program in the field of education and training which re-creates (simulates) a
dynamic phenomenon, climate, or knowledge. "Accordingly, the learner is granted the chance
for a new degree of comprehension. PC-based applications are usually dynamic with any logical
reality and are rooted. Educational simulations are however widely used depending on some
fundamental statistical model of processes, climate or experience which is unpredictable.
Simulation and gaming are instances of experiential education approaches, as they are immersive
and facilitate successful training to understand. Both include a partial believability, as per Brown
(2009), when respondents acknowledge a false scenario as briefly true. The similarities between
them lie in the way players interact. Players engage in the game games in conditions or
procedures to think from different real-world systems or guidelines. New research have shown
that PC-based game designers can create a general transition of thinking abilities that extend to a
wide range of domain-specific applications responsibilities. Those certain studies have been
using recent PC games to conduct scientific studies mostly on cognitive abilities various problem
- solving and developing strategies. Most modelling technologies (including simulators and
simulated environments) have the potential to simulate complex scenery, defects in structures,
12

acceleration, acceleration and visual signs. Certain systems are less complex and have much less
physical consistency, but reflect the preparation awareness, expertise and skills. Constructive
higher creativity simulated humans in a virtual world, using simulated hardware. Such
simulations involve substantial use through statistical techniques (e.g., simulation of an assembly
line’s performance depending on multiple adjustments in installation). Choosing an incorrect one
will dramatically increase the cost of training and/or, in certain cases, trigger detrimental
conversion of learning. To optimize education and return on investment (ROI), it is extremely
essential to choose the right classification of simulation, design simulation-based learning
keeping the simulation goals in mind, enable for the assessment of simulation processes and
results, and implement formative assessment of the training. This can only be done by the use of
trained practitioners in the fields of M&S, instructional architecture, and cognitive processes.
This question will be greatly amplified as the curriculum moves from costly high-end simulation
approaches to realistic games. Several of the games these days used during training tend to be
merely demonstrating innovative methods or reusing a simulation of game design instead of
attempting to close an instructional void. Excellently-defined educational criteria for training
and/or educational games would need to be created to guarantee that perhaps the games meet the
aims they intended to achieve, including that they will be not only gaining attention.
Performing cost analysis for assembly lines
As per the views of Sali and Sahin, (2016)An assembly line implies to a process of
manufacture (often considered progressive assembly) whereby components (usually compatible
parts) are inserted while semi-finished assembly travels from a workstation to other workstation
where the components are inserted sequentially before final assembly is made. Through
moving parts manually to assembly work and moving semi-finished assembly from any
workstation to other workstation, a final product could be assembled quicker and less labour-
intensive than making staff move parts to stationary assembly part. To minimize the cost of
for assembly and promote both processing and installation, a manufacturer will make every
attempt to model sections and items as follows:
 The minimal parts required for the component to work properly should be utilized. This
would presumably entail the removal with as many getting screwed operations as
practicable and the introduction as a method of clasp of further pressure and snap suits.
(Screws, though, are often used to have more stable connections. this has been claimed
13

that screws utilized in effective robotic assembly will increase the output-percentage of
suitable assembly line goods).
 Parts are built to be easy to grip and handle with no gripping devices in one side (i.e.
pieces do not knot or twist, are not messy, hard, delicate, brittle, elastic, etc.).
 Parts/sections are end-to-end and as far as practicable rotationally symmetric-or naturally
asymmetric elsewhere.
 Parts are built for simple alignment and installation (i.e., include chamfer and/or depths).
 The control as well as vision really isn’t limited for manually assembly.
 The insertion must be in straight line from the above, with respect to automatic assembly.
As per Abdelkhak, Salama and Eltawil, (2018) Cost estimation helps to reduce the expense
of manufacturing or production time. The assembly expense or period will typically be measured
by the amount of changes in assembly orientation, changes to the equipment and changes in
assembly process forms. In case of an automatic assembly device, robots are being used to
comprehend the pieces and position them with assembly instruments. The assembly method
range is defined by part's geometric form, dimension, volume, etc., which may typically include
magnetic, steam, adhesive grips, etc. A shift in assembly alignment or assembly method is time
consuming and can typically raise assembly costs. To finish assembly process, various forms of
assembly operations are needed, such as pressing, screwing, riveting etc. Improvements in
assembly processes can also involve change in machine, thereby increasing assembly period and
expense. Unlike competitive procurement of PCB assembly, Will Cost starts with internal
evaluation of the estimated expense of the PCB assembly. Typically speaking, development by
PCB engineers, hardware developers and computer programmers can be of tremendous benefit in
determining the required PCB costs, BOM costs, and tooling costs. Procurement collects the
expected production prices, and assigns estimated manufacturing costs and gross margins
to supply chain. Here, supply chain gathers the prices and applies amounts to decide the cost will
be. Remember that when it comes to printed-circuit-board assemblies (PCBA's), Costs still uses
strategic procurement. That's because cost structure of entire PCBA in higher-volume PCB
assembly ventures is generally upwards of 80 percent materials (Circuit board as well as BOM
costs), then it is not sensible to fully analyse manufacturing cost of each element, so they have to
costs components utilizing strategic sourcing methods. Most hardware corporations do not
perform may cost PCB assembly line because they feel that their current resources
14

are complicated and time consuming. It could not be valid upon closer examination. Remember
that materials are possibly 80 percent of PCBA bill. Company have accomplished 80 per cent
of their Cost target by actually taking care of material expense. Company can start by
requiring suppliers to submit quotes with completely disclosed material costs, particularly for
each BOM sequence. Particularly if that's not appealing to certain PCB assembly manufactures.
When they concentrate instead on lowest possible cost of a PCBA venture, it's easy, because they
can pick the supplier or provider can provide with the lowest quote. Yet actual competitive
procurement doesn't just rely on lowest, while Cost should recognize other main factors.
performing a cost analysis should may sound overwhelming but is really quite realistic for the
electronic assemblies outsourced by most manufacturers. Use another quick and simple method
to compare the current cost for a single pcb assembly as well as decide whether it is sustainable.
It is evident from above evaluation that FR4 is best cost-effective substrate for multiple layer
PCBs and durability is much higher than other base content. Then how do use FR4 content to
lower cost of PCBs? One easy approach is to use FR4 content cheaper and lower in price. This
will seem to be a reasonable way at first glance if the consistency of board is appropriate but
consider again before company make final decision. According to Higher-quality FR4 content
with a low price is more reliable, and later they can find it much harder to monitor quality of
PCBs, which is particularly valid in mass manufacturing. FR4 (FR = Flame Retardent) is an
adhesive laminate in fiberglass. This is most widely used resource for PCB. 1.60 millimetres
(0.062inch). FR4 requires 8 layers of plastic constructed from glass fibre. The average
atmospheric temperature dependent on the size is around 120 ° and 130 ° C. FR4 is most
commonly used PCB core material in the China, and next one is FR1 after which FR2. Yet
typically, FR1 and FR2 are being required for 1-layer PCBs, since they are never ideal for gaps.
Construction of multiple layer PCBs also isn't suggested with FR3. The highest range is from
15

FR4. FR4 is commonly used as making one-layer to layered PCBs is fine. With FR4 alone, PCB
companies may make all sorts of PCBs far simpler to manage and controls quality, and
ultimately this can reduce costs. Reducing costs by utilizing lower quality FR4 content is very
efficient for prototypes, however the management costs would rise in mass production, which is
particularly important in large scale production of multiple layer PCBs. Therefore, since low
quality FR4 typically has smaller Tg and better Tce, cost of assembling PCBs can increase. And
while the expense of the PCBs is decreased, the quality increasing not is lowered for the finished
goods.
Performing time analysis for assembly lines
According to the views of Otto and Battaïa, (2017) a time-series is continuous set of quantitative
data points. In trading, a time series records movement of selected data points, including price
of security, over a given duration of time against reported datasets at frequent intervals. There
really is no minimal or maximum period of duration to be used, requiring the details to be
processed in a fashion that offers the detail the participant or researcher reviewing the operation
is after (Latino, Latino and Latino, 2019). The methods used to build integrated circuits are also
becoming the industry norm. They vary mainly in the option of binding materials (epoxy or
metallurgical contact), interconnection procedures (cables, flip-chip, or mechanical binding
tape), and freezing processes (crease welding, wrapping of belt flame, or plastic extensibility).
The central tasks are specific to thinner and thick-film loops in common. Time analysis is
particularly helpful when designing circuits with antenna whereby only a designer can find stray
patterns, reflections, or surface bounce alerts. The detection of time domain stimuli
helps engineer to distinguish international signals from intended stimulus in time, therefore
distinguishing the polluted signals. In area of network connectivity, ATM ports, core adapters,
fiber channel, and a number of gateway products, machine transfer speeds, clock levels
rise, corresponding processor's processing frequency becomes higher and higher; data delivery,
audio, picture speeds is much higher beyond 500Mbps, thousands of the megabytes or perhaps
even multiple guitar backplane are also growing more common. Downtime requires optimizing
machine level data signals as rapidly as possible; a number of high-speed architecture problems
have become increasingly prevalent as a consequence of digital signal produced wavelengths and
edge speeds. If the channel interconnection lag is even greater than 20% of time flipping edge
channel, the signal wire board may display the results of transmission cable, this concept has
16

been the high-speed architecture. Speed issue tends to put more difficulties to hardware
development, from logical point there's many correct designs, if handled incorrectly in actual
PCB design would then result to failure of entire design; pursuit of such a case becomes more
evident in a progressively high-speed network field of communication. Problems induced by
high-speed signal overshooting, undershooting, flickering, ringing, intermodulation, etc. can
adversely disrupt the usual timing mechanism, minimize timing margin of pushing people
worried about the effect of optical waveform anomalies on timing performance efficiency. Due
to accelerated tempo, the timing is crucial, regardless of the method in progress how detailed
interpretation of the values will offer severe repercussions of any failure and improve the
program. In high-speed architecture, the effect is more important timing problems, this article
would concentrate on higher-speed timing analysis including simulator technique creation.
As per Caputo, Pelagagge and Salini, (2016) through wireless high-speed loops, data
transfer over the network is usually ordered by clock and generates power signals. Mostly by
timing criteria, long signal lag or signal lag pairing, chip can submit and receive information can
contribute to inappropriate breach of signal scheduling and functional disturbances. Connectivity
postponement and started to ring concept can be insignificant in the low-speed scheme, as there
is sufficient time in just such a lower-speed signal system to achieve a stable state. In higher-
speed systems, though, the surface level of speed is decreased, the network clock frequency is
raised, the signal transfer between the unit and synchronization period is reduced, the equal
power of transmission line is interrupted and skewed, the inductance is transformed to digital
signal, combined with signal latency mismatch as well as other variables. To be effectively
latched into data of internal unit, data must be held at input of the transmitter chip long sufficient
to guarantee that the efficient signal is right testing latch timer, this period called hold period.
The receiver shield by second data padlock clock edge in common bus clock, whereas drive end
of next data is glommed to data transmission hand. Therefore, in order to satisfy receiver end
processing deadline, accurate data should be maintained until the next transmission signal data
hits flip-flop latches, that allows the CLKA transmission clock to postpone the transmitted data
signal much less than interval. A printed circuit boards are device that links multi-layered printed
circuit panel to two transmitting lines. A thru is hole bored by means of printed circuit board and
lacquered with a conductive substance. (This studded hole is alluded to as cylinder in article.) A
circular glove of conductive material is positioned around cylinder on every layer on
17

which transmission line is linked to cylinder. Such pads have transmission line connections. The
Via coil moves into at least one patch antenna in most super-fast integrated circuits. A clearance
gap is inserted in ground floor, such that cylinder will move without contact. High-speed
networking computer engineers evaluate signals at house, in "Time-Domain," as a feature of
time. Nevertheless, in "frequency domain" signal may also be interpreted as a frequency element.
Digital engineers need to be able to use frequency domain measures for interpreting time domain
behaviour, as the communication magnitude is up to one million pieces a second. Also, in
electronic applications, radio frequency / microwaves engineers sometimes have to analyse
signals and master time series measurements.
As per Li, Janardhanan, Tang and Nielsen, (2018) being a more successful designer,
improving the degree of comfort from both areas provides more innovative construction choices
and even improved debugging. If modal framework is applied to the research toolkit, it will
extend this fluidity in the time framework and frequency area further. The linear domain
explores frequencies at which materials, liquids or signals that behave erratically and how
shifting types can be reacted to higher vibration instantaneously. The modal framework can be
used to evaluate devices and constructs during the vibratory intensity of earthquake. There are
three separate points of view from which signals will study time, amplitude and modulation
domains. Three collections of vertical slits with convex, curved and wide-angle lenses may be
contrasted. Everyone has the same details, but new connections are observed by observing the
data displayed differently. By separating the different factors and materials, one sees connections
between them. Such three fields of signal evaluation enable the engineering to "map" features
of signal.
Significance in simulation of PCB assembly lines
In recent time, developing an assembly line will not end at basic research even though the
research requires very comprehensive sectors of one assembly line, or starts from particular
customer to distribution of the goods (Lade, Ghosh and Srinivasan, 2017). Quality development
thus has to be robust for continuous growth of efficiency and creativity. The method of designing
the assembly line of printed circuit board involves a soft and hard optimisation. Strong positive
association’s improvements in the equipment by development, and soft improvement is found by
emulation of the actual assembly line through evaluation. The work aims at identifying the
inefficiencies, seeking a solution, and developing method of improvement by adjusting the
18

functioning of the system on the assembly line until another optimum configuration is
conclusive. Arena Technology is the framework which could be used for every simulation. The
analysis data is gathered from actual assembly line (Lade, Ghosh and Srinivasan, 2017). For the
region, the highest performing hypothesis can be used for no temporary information available,
such as data that could be obtained from the manually stations. Besides the research purpose is to
gain a better yield by strengthening the moment of installation of the PCB procedure.
Consequently, the effect of all such efforts to automate PCB's production line for continuous
enhancement is to produce high quality goods, decrease prices, and shorten the distribution
period and satisfy consumer standards. After receiving the simulation outcomes and having
found some problems and addressed them with the local specialist PCB Firm, we agreed to
recommend the following things for process improvement:
 Coordinate the Cell supervisor to reduce the amount of time mostly on mechanical
working area, the organization wants the one worker doing the same task but not to
position various facets on one platform (with the opportunity to rotate the worker on
various tracks).
 For improving functional, there are major issues (as stated in the original following
sections) and general programming issues for many other assembly line terminals; the
response to general programming problems is to provide offline instruction for the
appropriate workers at each assembly line location.
 Execute totally separate oven investigations where even the changes in climate is the
main programming problem and repetitive several occasions until the temperature and
time in various districts are governed with particular time across each region, so that the
material and modules in the combustion curve for each zone will be well comparable.
Most people can consider circuit sheets published whenever it has been presented in the
assembly. These are the small green chips researched in lines and sections of copper that you
will discover at the heart of the devastated electronic device. These frames are made of
polyurethane, aluminium lines and other mechanical components and thus are retained together
along with epoxy and safeguarded by a patch veil. This patch cover is the spot that originally
comes from brand green colouring. The PCBA operation reliably usually starts with the PCB's
most fundamental concept: the core, which consists of few other layers, and even in the
19

effectiveness of the last PCB, that everybody takes on an essential role. These substitution layers
encompass:
 Substrate: This is really a PCB foundation document. This confers its unbending nature
on the PCB.
 Copper: A thin sheet of semiconducting copper foil is applied on every practical side of
the PCB with one side if it is a single side PCB, and on both sides if it is a dual sided
PCB. This is accompanied by the sheet of copper (Chen and Khosla HRL Laboratories
LLC, 2019).
 Solder veil: the patched covering will be over the copper plate, giving each PCB a green
colouring of its hallmark. It prevents the resulting copper from unintentionally touching
other electronic circuits, which may result in such a short. The patch holds all in its place,
only at end of the day. Spots in the patched veil are the location where weld is attached to
the board's attach pieces. Patch cover is a crucial improvement in the seamless
construction of PCBA, as it prohibits attachment from happening on unintended sections
with shorts staying apart.
 Silkscreen: The last coating on a PCB board consists of a white silkscreen. This feature
includes character imprints and pictures to the PCB. This shows the capability of each
component on board.
The three essential PCB types include:
 Rigid PCB: the much more universally acknowledged type of PCB foundation is an
inflexible one which represents a greater proportion of PCBAs. The solid core of an
inflexible PCB provides rigidity and thickness to the plate. The solid PCB bases are made
up of a few different materials. Stainless steel is the most commonly known, usually
assigned as "FR4 ». More durable PCBs are made from materials such as epoxy or
phenolic, but both are less stable than FR4.
 Surface Mount Technology: Sensitive sections are usually mounted on the outside of
the plate, some very low, for example, capacitors or electrodes. For high voltage device
this is called SMD get ready. Innovation in substrate mounting may be related to small
segments and integrated circuits (ICs). For example, we are qualified with min. metric
01005 for increasing package which is significantly smaller than the time frame of a
permanent marker point.
20

Via Hole Technology: Performs excellently on sections with links or cables to be placed on
board by preventing them across ready holes. On the other side of the board the extra lead
component has to be patched. This invention is related to gatherings of PCBs comprising
massive components, such as capacitors, coils to pick. That is because of the THT and SMT
credentials, they do need to undergo distinctive interconnection procedures. The following essay
would discuss other estimations of content and form beyond the PCB foundation as they relate to
the PCB collection process in conjunction with THT, SMT and combined developments
(Walker, Guest and Turner, 2017).
The different stages of the PCB assembly process such as attaching powder bed to
something like the board, selecting and placing the elements, welding, inspecting and testing. All
these principles are essential, and must be controlled to ensure the highest performance product
is manufactured. The PCB assembly line mentioned below implies high voltage modules were
used as practically all PCB assemblies are using surface mount modern technology.
 Solder paste: The filler metal must be applied to those sections of the panel where
welding is needed prior to attaching the modules to a board. Such areas are usually the
part pads. This is implemented with the help of a solder computer monitor. The solder
paste is a mixture of tiny solder grains combined with flux. This can be processed in a
method somewhat close to that of other printing systems. By using fuse screen, typically
mounted on the ground and reported in the correct spot, a racer is pushed throughout the
screen pushing via the openings in the computer monitor and onto ground a tiny lift of
sheet thickness.
 Pick and position: The surface with the attached concrete surface is then moved through
the manufacturing and assembly process throughout that phase of the production line. On
this a part filled system takes the modules from the dvds or other containers and positions
them throughout the proper location on the wall. This was usually a manual
methodology, finally completed with a few rubber bands, wherein formulating agents
required selecting and placing sections by hand. Fortunately this advancement is now a
machinery process among PCB designers. This change has happened to a great degree
because computers would usually be more precise and efficient than humans. Although
people can work easily, weariness and eye exhaustion are usually set to work in these
small fragments after a few hours.
21

 Soldering: Once the elements have also been introduced to the committee, the next phase
of the installation is to carry through the welding process computer system for the
manufacturing process. Even though some panels increasing pass across a wave welding
process machine, some days this method is not commonly used for high voltage modules.
 Inspection: They are always checked after the panels are through the welding process.
Manual testing is not a choice for surface mounting boards that use a hundred modules or
more. Simple optical testing is also a much more effective option. There are advanced
technologies that can inspect panels and identify poor joints, misguided materials and the
incorrect element under some situations. Wave welding is really the manually trying to
patch fully automated version, but requires an entirely different process. Whenever the
PTH section is built, the board will be put on just one transportation track. This moment,
the transport line passes across a specific stove in which a flood of additionally includes
rinses up over the load foundation. This welds most of the pins into the double at the base
of the board. For double-sided PCBs this kind of welding is impossible, as joining the
entire PCB side will make any vulnerable electronic parts useless (Plattner and
Schapranow, 2015)
 Test: The computer goods have to be checked before they enter the plant. There are
several methods they can be put to the test. Further opinions on research technologies and
methodologies can be located on this website's "Research and Measurement" portion.
Should either of these values, namely voltage, current or indicator yield, display
inappropriate vacillation or touch crests beyond a predestined scope, the PCB would
come out on top of the test. Therefore the fizzled PCB may be recycled or rejected,
depending on the values of the company. Testing is and by far the most substantial
improvement in the PCB assembly process, as it chooses whether the procedure is
achieved or disappointed. Similarly, this research is the reason for which regular
checking and analysis is so important in the process of getting together.
 Feedback: The performances will be tracked to ensure the production system is
performed satisfactorily. This is done by the analysis of any observed faults. The perfect
scenario is at the optical organized, since this usually takes place directly after the spot
weld stage. This ensures process weaknesses can be easily found and resolved since so
many committees with the same major issue are installed.
22

Significance of finding efficiency of assemble line layout
As per views of Kundu, Rossini and Portioli-Staudacher, (2019) in the case of the printed
circuit boards, a line performance is the average of the number of hours expended on pick-and -
place unit, separated by number of hours used on SMT mounting lines. The performance of the
line may be calculated differently, even by contrasting output against a normal standard of
acceptable output and line performance. This requires capacity usage. For manufacturing
companies and assembly lines of the printed circuit boards, comprehension of line-efficiency is
quite crucial. The more easily a corporation will churn off completely-assembled printed circuit
boards, more profits the PCB maker would be willing to generate. When a PCB maker
systemically loses efficiency and underproduction, the problem needs to be identified and rooted
quickly, to ensure that business failure is avoided. The judgment about the usage of SMT line
output or the measurement of production line output must be decided when measuring line
performance. Many experts regard the performance of SMT row as being sturdier. The line
output calculation is the period that a large volume pick-and-place system positions component
on circuit board, separated by the number of hours on SMT assembly line. Simpler: that is hours
of deployment separated by workplace hours by around 100. It is a easy, direct output
calculation. The reason for which many executives are reticent to be using efficiency in assembly
lines rather than SMT lines is the lack of time. Instead of full period, we focus the percentage on
real time and therefore do not taking into account the usage of labour. It is necessary to
remember that efficiency is influenced by external factors which assembly manager finds
difficult to regulate. The demand on the market defines the amount needed by a plant for printing
circuit assembly.
According to Make, Rashid and Razali, (2017) line output calculation is also quick and painless
operation. The duration and period of the positioning is often very simple to measure. In order
for a quick analysis of such documents to show the location period pick-and-place controller will
provide a complete log of how the devices position parts and whether they don't. It is easier to
measure working hours because someone is responsible for keeping structured, automated staff
kinds of records. Note that, while organization breaks are permitted for workers, such breaks are
recorded as hours employed. Pauses, dinners and workshops will be phased out to render the
lines more efficient and that workers are still available during working hours. A simple and
truthful indicator of the line efficiency is result of this form of measurement. No space for
23

disappointment is in place or framework is in place, but there is denying the fact whether or not
steps are needed whether or not such amendments will have an impact.
Although data collection is very significant, what is achieved with this data is just as
essential. In addition to estimating line output, it is important to assess and evaluate team success
by defining the variables impacting this line results. Initially, assembly lines were used to boost
plant productivity as well as efficiency. Advances are developed on a daily basis in production
lines, when better and increasingly efficient approaches are discovered to meet goal of improved
output (number of goods manufactured during a certain period)./ Corporate leaders were aware
of applying these principles towards many other business sectors, from product innovation to
planning, whilst assembly line methods mainly implement to manufacturing processes methods.
For any engineering sector, productivity is an essential consideration. Suppose two identical
goods are available at same price and value but use different technology. Then individuals would
always buy less powerful the other. Efficiency is therefore essentially appropriate. Efficiency is
one key explanation that it is common with compact size that it provides, from the viewpoint of
electronic circuits. Find converters including dc/dc, dc/ac, ac/dc or ac/ac. Organisation may do
that without the usage of electrical technology. dc/dc conversion could be achieved with resistive
dividing capacity, dc/ac or ac/dc could be produced with rotary converters while ac/ac needs a
combined motor generator system to transform. And all these transition approaches are often
much less effective and voluminous.
As per Zhang, Liu, Evans and Yin, (2017) for the benefit of both the climate and sustainable
productivity, minimizing energy usage in PCB's procurement sector is of considerable
significance. While it is one of the key challenges in PCB's production industries, very little
work has been carried out in this area because of several practical factors. Furthermore, a
significant strategic aspect is the probability of handling efficiently a manufacturing chain to
satisfy external expectations and domestic problems, since consumers usually tend to get the best
quality on a fast-dating basis for the right value. So, PCB organisations are expected to adapt to
new developments, including energy conservation, to be competition on modern world markets.
The efficiency of PCB design is determined. The conceptualization and execution of its
framework establishes the existence and adds to long life of system under that it is employed. A
variety of architecture issues are being reported as a consequence of on-going work in printed
circuit board industrial sector. The performance of circuit board system can be significantly
24

enhanced with minor improvements to the specification in layout process. Several online
calculators allow organisation to learn the optimum layer thickness that guarantees a smooth
flow. In case if circuit board makes current movement smoothly is the purpose obviously
accomplished. This current flow is necessary if the system is to operate properly. The option of
channel length, which does not conflict with current traffic, is also a successful way to
maximize layout efficiency. Two approaches to increase the performance of the PCB system are
noise reduction and signal enhancement. Noise reduction can only be accomplished if the
remnants of signal are put in conjunction in order not to lead to sound separately. The power
circuits produce destructive disturbances in control circuits, which emanate from large current
supplies. It can be done by splitting power and control soil. At point near start of supply route,
they have to be joined together in PCB.
Conclusion
In the conclusion of file it has been stated that, an integrated PCB is called a PCB with parts
placed on, and the production procedure is named PCB assembly or PCBA for short. The copper
cabling on plain panel, named trails, attach the connections and connectors electrical current to
each other units. The work discuss above development preparation in the assembly of
electronics and especially in assembly PCBs. Our purpose is to recognise the typical issues
stemming from manufacturing process and to provide an examination of the remedy
recommended methodologies in the Literature. In order to have access to this theoretical point of
view, developers will critically summarize the development planning permission in Assembling
PCB. The research is performed to consider the method of assembling PCBs using flexism
approach simulations. The viability of the flow logic mechanism is measured to boost the overall
system performance, particularly effect of increasing line configuration. The amount of
workforce at the production line of automobile jack assembly is four manpower is depending on
the current situation. The power is generated from study is three manpower’s. Hence the amount
of man's power was that from four man's power and authority to three man's forces. Thus the
employees' flow motions have been adjusted to suit each worker's volume of work. In
conclusion, employing line balance approach in this venture has shown that the losses resulted in
the line considerably improved besides creating better performance rate and output quality of the
business.
25

REFERENCES
Books and Journals
Abdelkhak, M., Salama, S. and Eltawil, A.B., 2018, January. Improving Efficiency of TV PCB
Assembly Line Using a Discrete Event Simulation Approach: A Case Study.
In Proceedings of the 10th International Conference on Computer Modeling and
Simulation (pp. 211-215).
Abdelkhak, M., Salama, S. and Eltawil, A.B., 2018, January. Improving Efficiency of TV PCB
Assembly Line Using a Discrete Event Simulation Approach: A Case Study.
In Proceedings of the 10th International Conference on Computer Modeling and
Simulation (pp. 211-215).
Ajao, L. A. and et. al., 2016. Learning of embedded system design, simulation and
implementation: A technical approach. American Journal of Embedded Systems and
Applications. 3(3). pp.35-42.
Bohnhorst, A., Kirk, A. T. and Zimmermann, S., 2016. Simulation aided design of a low cost ion
mobility spectrometer based on printed circuit boards. International Journal for Ion
Mobility Spectrometry. 19(2-3). pp.167-174.
Caputo, A.C., Pelagagge, P.M. and Salini, P., 2016. Selection of assembly lines feeding policies
based on parts features. IFAC-PapersOnLine, 49(12), pp.185-190.
Chen, Y. and Khosla, D., HRL Laboratories LLC, 2019. System and method for performing real-
time video object recognition utilizing convolutional neural networks. U.S. Patent 10,289,910.
Fitzpatrick, D., 2017. Analog design and simulation using OrCAD Capture and PSpice. Newnes.
Jiao, Y. L. and et. al., 2018. Multi-objective storage location allocation optimization and
simulation analysis of automated warehouse based on multi-population genetic
algorithm. Concurrent Engineering. 26(4). pp.367-377.
Jo, D. S. and Kim, J. W., 2018. A survey on characteristics and application domains of 3D
factory simulation technology. The Journal of Information Systems. 27(4). pp.35-70.
Kundu, K., Rossini, M. and Portioli-Staudacher, A., 2019. A study of a kanban based assembly
line feeding system through integration of simulation and particle swarm
optimization. International Journal of Industrial Engineering Computations, 10(3),
pp.421-442.
Lade, P., Ghosh, R. and Srinivasan, S., 2017. Manufacturing analytics and industrial internet of
things. IEEE Intelligent Systems, 32(3), pp.74-79.
Latino, M.A., Latino, R.J. and Latino, K.C., 2019. Root cause analysis: improving performance
for bottom-line results. CRC press.
Li, Z., Janardhanan, M.N., Tang, Q. and Nielsen, P., 2018. Mathematical model and
metaheuristics for simultaneous balancing and sequencing of a robotic mixed-model
assembly line. Engineering Optimization, 50(5), pp.877-893.
Make, M.R.A., Rashid, M.F.F.A. and Razali, M.M., 2017. A review of two-sided assembly line
balancing problem. The International Journal of Advanced Manufacturing
Technology, 89(5-8), pp.1743-1763.
Otto, A. and Battaïa, O., 2017. Reducing physical ergonomic risks at assembly lines by line
balancing and job rotation: A survey. Computers & Industrial Engineering, 111, pp.467-
480.
26

Plattner, H. and Schapranow, M.P., Hasso-Plattner-Institut fuer Softwaresystemtechnik GmbH,
2015. Transparent control of access invoking real-time analysis of the query history. U.S. Patent
9,015,812.
Sali, M. and Sahin, E., 2016. Line feeding optimization for Just in Time assembly lines: An
application to the automotive industry. International Journal of Production
Economics, 174, pp.54-67.
Trung, N. K. and et. al., 2015. Analysis and PCB design of class D inverter for wireless power
transfer systems operating at 13.56 MHz. IEEJ Journal of Industry Applications. 4(6).
pp.703-713.
Walker, C.R., Guest, R.H. and Turner, A.N., 2017. The foreman on the assembly line (Vol. 11).
Taylor & Francis.
Zhang, X., Liu, C., Li, W., Evans, S. and Yin, Y., 2017. Effects of key enabling technologies for
seru production on sustainable performance. Omega, 66, pp.290-307.
27